ACM SIGDA Low Power
Technical Committee
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Workshop

Cross-layer Power and Thermal Management

2009-05-31 20:24:09
SIGDA LPTC
Anaheim, California, USA
June 9, 2008


Reducing power consumption and managing temperature have become two most critical issues in electronic designs. This is reflected in the topics of many conference and journal papers. However, there are insufficient opportunities for researchers in different areas to interact. This workshop will serve the purpose of “creating conversations” among researchers with different backgrounds. A wide range of topics are covered in this workshop; the topics are divided into five different layers: circuits and devices, packaging, architectures, systems, and software design. Five experts, from academia and industry, are invited to present their views on existing solutions and future challenges in power and thermal management. Each speaker will explain the state-of-the-art technology, relationships and interactions with other layers in electronic design, and point out directions for future research. This workshop is the first of its kind and will bring together many researchers from different areas to develop new visions for research on power and thermal management.

We hope you will find this workshop an exciting opportunity for interacting with fellow researchers.

Yung-Hsiang Lu (Purdue University)
Ricardo Bianchini (Rutgers University)
Workshop Co-Organizers

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