=============================================================================== SIGDA -- The Resource for EDA Professionals http://www.sigda.org This newsletter is a free service for current SIGDA members and is added automatically with a new SIGDA membership. Circulation: 2,700 =============================================================================== 15 November 2007 ACM/SIGDA E-NEWSLETTER Vol. 37, No. 22 Online archive: http://www.sigda.org/newsletter =============================================================================== Contents of this E-NEWSLETTER: (1) SIGDA News Contributing author: Matthew Guthaus Contributing author: Lin Yuan Contributing author: Qing Wu (2) What are high-K and low-K dielectrics? Author: Jerzy Ruzyllo, Penn State University (3) Paper Submission Deadlines From: Hai Zhou (4) Upcoming Symposia, Conferences and Workshops From: Hai Zhou (5) Upcoming Funding Opportunities From: Qinru Qiu (6) ACM/SIGDA Outstanding New Faculty Award From: Martin D.F. Wong =============================================================================== Dear ACM/SIGDA members, In this issue, we have included the " What are high-K and low-K dielectrics?" column by Jerzy Ruzyllo at the Penn State University. In addition, "SIGDA News" column contains a number of fresh headlines. We have also updated the contents of other regular columns. As always, we welcome your comments and suggestions. If you would like to participate or contribute to the content of the E-Newsletter, please feel free to contact any of us. Qing Wu, E-Newsletter Editor; Matthew Guthaus, E-Newsletter Associate Editor; Marc Riedel, E-Newsletter Associate Editor; Qinru Qiu, E-Newsletter Associate Editor; Lin Yuan, E-Newsletter Associate Editor; Hai Zhou, E-Newsletter Associate Editor; =============================================================================== SIGDA News ----------------------- "Source Code Release For The FGR Global Router" http://vlsicad.eecs.umich.edu/BK/FGR/ FGR - the global router that took 1st place in the two-dimensional category of the ISPD 2007 contest is now available in source code and binaries for academic use. Technical details were described in an an ICCAD 2007 paper (presented last Wednesday afternoon), but the Web page gives most recent results, which improve upon the ISPD 2007 contest for every benchmark, and sometimes by as much as 30%. Commercial licenses will be available upon request. "CMOS Running Out of Gas, New Effort Looks for Scalable Replacement, ICCAD Keynoter Says" http://www.edn.com/article/CA6498322.html?industryid=47037 The CMOS FET, the main fabric and process used for the production of most semiconductors today, will run out of gas by the year 2020, so multiple research projects -- directed by the Semiconductor Research Corporation's (SRC) Nanoelectronics Research Initiative -- are diligently looking for new materials and semiconductor fabrics to allow semiconductor scaling to continue well into the second half of the century. "Google takes wraps off mobile ambitions " http://www.eetimes.com/news/latest/showArticle.jhtml?articleID=202802513 Google Inc. has finally taken the wraps off its long rumored ambitions in the mobile phone space, announcing a wide ranging alliance with 33 companies that includes handset makers, chip suppliers and carriers to create low cost phones based on the Linux open source OS. "Intel Formally Debuts 45-nm Penryn Processors" http://www.edn.com/article/CA6499824.html Intel Corp. released on Sunday formal details on the long-awaited server and high-end PC .Penryn. processors using for the first time what Intel Corp. co-founder Gordon Moore calls one of the biggest transistor advancements in 40 years. The "Penry" processors use the company.s hafnium-based high-k metal gate (Hi-k) formula, which is meant to decrease electricity leaks as Intel noted. In addition to aiming to increase computer performance and saving energy use, the 16 new processors are lead-free, RoHS-compliant and will be halogen-free next year. These advancements combined with new processor features allow Intel to design products that are two-thirds the size of previous versions and thus more cost-effective, as well as the ability next year to pursue new ultra mobile and consumer electronics SoC opportunities, the company claimed. "The Mathworks Adds Support For Parallel Apps, Multithreaded Computations, 64-bit Platforms" http://www.edn.com/article/CA6499807.html Aimed at helping engineers and scientists model increasingly complex systems in less time by allowing development of parallel applications independently of the resources that are available for execution, Natick, Mass.-based technical computing and model-based design software provider The MathWorks today announced four enhancements in its MATLAB and Distributed Computing Toolbox products meant to allow increased performance and large data set handling. In addition to the supports for multithreaded computation for multicore systems and 64-bit Solaris platforms, the MATLAB Distributing Computing Toolbox now offers capabilities to develop applications that interleave parallel and serial code and interactively prototyping parallel algorithms on a desktop computer by running four local MATLAB sessions. With MATLAB and Distributed Computing Toolbox, engineers can prototype parallel applications on multicore desktop computers using up to four processors and four MATLAB sessions. For more computing power, these applications can scale to a computer cluster without code change by utilizing the MATLAB Distributed Computing Engine. The applications can also include serial code that is executed in the desktop machine, the company noted. "Qualcomm Moves 3G Chips to 45-nm Process" http://www.edn.com/article/CA6501135.html Qualcomm Inc. Tuesday announced that it has made the first phone call on a 3G chip manufactured with 45-nm process technology. Qualcomm's call was made on the 45-nm chips received from Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest dedicated semiconductor foundry. Qualcomm did not state the technical details of the 45-nm chips in its release. However, industry sources report three new 45-nm single-chip solutions targeted for mass-market smartphones that include integrated solutions on dual core technology, multi-band RF transceiver, ARM11 apps processor, Bluetooth 2.1 EDR, FM radio, GPS and a 5 Mpixel camera. Sources report the chipsets support UMTS or EV-DO Rev B, with full backward compatibility and GPS functionality, and that sampling isn't expected until Q4 2008, with ramp likely to follow in 2009. "IBM Selects Virtutech's Simulator for Power Architecture" http://www.eetimes.com/news/design/showArticle.jhtml?articleID=203100336 Virtutech, Inc announced that its SimicsTM product has been selected by IBM to create advanced, system-level simulation models for IBM's next-generation embedded processor cores, beginning with the PowerPC 464FP core. As part of a broader strategic roadmap designed to support its Power ArchitectureTM ecosystem, IBM will be able to leverage the virtualized development environment provided by Simics to enable software development ahead of silicon availability, offering quality, productivity and time-to-market advantages for IBM customers. "Nanoscale Chip Verification: A Massively Analog Problem?" http://eetimes.com/news/design/showArticle.jhtml?articleID=202802481 As semiconductor manufacturing technology deals increasingly with finer and finer measurements, verification of nanoscale components presents a problem of scale, requiring a scaling of verification technology commensurate with the shrinking of technologies like CMOS. "Insights Using NAND Flash in Portable Designs" http://eetimes.com/news/design/showArticle.jhtml?articleID=202803935 As the raging success of Apple's iPod still rings in our ears, NAND flash memory is seen as the rising star of solid-state memory for portable and consumer applications. "Deciphering the Disk Drive Conundrum" http://eetimes.com/news/design/showArticle.jhtml?articleID=202802913 Issues of privacy, information security and identity theft are concerns for all organizations, big and small. Individuals and corporations alike find themselves increasingly vulnerable to the destruction and corruption of sensitive data, including transaction records, banking details, password files, digital photos and even video clips. "Agfa to Work on Plastic Memory With Thinfilm" http://eetimes.com/news/design/showArticle.jhtml?articleID=202805707 Printed electronics technology developer Thin Film Electronics ASA has signed up film and camera company Agfa-Gevaert NV to a joint development agreement for the production of printed organic memories. "Needed: A New Design-to-Fab Flow For Advanced ICs" http://eetimes.com/news/design/showArticle.jhtml?articleID=202805759 As the increasing precision of hardware geometries pushes the limits of visible-light lithography, manufacturers' reliance on DRC and DFM checks can make the difference between manufacturable and nonmanufacturable designs. "India Is Most Wireless-Focused Design Location, Says Synopsys" http://eetimes.com/news/design/showArticle.jhtml?articleID=202805760 For all of those that thought Europe was the hotbed of wireless IC design EDA company Synopsys has some evidence that my force a change of mind. "Asics Added To MEMS Wafers" http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202801147 Microelectromechanical system (MEMS) chips are currently joined to separate CMOS ASICs after separate wafers are diced. A new technique called "chip-on-MEMS" bonds ASIC dice atop an entire MEMS wafer before dicing, according to developer VTI Technologies Oy. "Under The Hood: Hot 3G Phone Owes Debt To Analog" http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202800251 Nokia's hot little number in 3G phones these days is the N95. Sitting somewhere at the top of the lineup, the N95 gets anointed in Nokia's marketing as a "multimedia computer," but in one view, it's the still the analog IC that sets it apart. "Nanoscale Chip Verification: A Massively Analog Problem?" http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202802481 A while back, I moderated a panel entitled "The End of Traditional CMOS." This excellent discussion arrived at a somewhat optimistic conclusion: The rumors of the death of CMOS have been greatly exaggerated. The truth is, "simple" CMOS scaling has not been simple for a long time. Though it is getting harder, we have been dealing with new processes, materials, devices and circuits for decades, and we will continue to find appropriate process "enhancements." The trajectory of current manufacturing technology can reasonably be expected to get us to about 20 nm. "Optical Signals Interact With MEMS" http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202802607 Micro- and nanoscale mechanical structures have long been used to sculpt and channel optical signals, from waveguides to resonators, but lately the direction of influence has reversed. Now optical signals are being used to manipulate these mechanical structures. Recently, researchers at both the Massachusetts Institute of Technology (Cambridge) and Cornell University (Ithaca, N.Y.) demonstrated new methods of using optical signals to control mechanical structures, at least one group of material scientists proposing to close the feedback loop. "True Design-For-Manufacturability Critical To 65-Nm Design Success" http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202803596 True design for manufacturability (DFM) at 65-nm and below technology nodes has become more critical due to the shrinking of the critical dimensions of structures on the chip where the same absolute physical variations can result in relatively large electrical variations. "Software Specialist Fogclear Focuses Post-Silicon" http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202804270 First silicon, the initial prototype of a new chip design, often involves days of tedious, labor-intensive debugging and mask repairs before production-ready chips can be produced. Most problems with initial prototypes can be diagnosed, but repairing problems deep inside a chip becomes increasingly difficult as design rules shrink and mask levels are added. Some have proposed adding extra tunable structures to affect repairs post-silicon. "Gartner Warns of 2008 Semi Industry Downturn" http://www.edn.com/article/CA6501055.html?industryid=47037 Gartner has warned that a downturn could be coming in 2008 for the semiconductor industry. In a Gartner newsletter dated November 12, the firm noted government economists and financial counselors are now warning that the United States could experience a recession due to sub-prime mortgage debt and the U.S.-initiated, and now global, "credit crunch". "SIA: Global Chip Sales to Grow at 7.7% CAGR to Reach $321B in 2010" http://www.edn.com/article/CA6501170.html?industryid=47037 During the Semiconductor Industry Association's (SIA) webcast this morning, hosted by EDN sister publication Semiconductor International, of the industry group's annual forecast of global semiconductor sales, the SIA is projecting that sales of chips will exceed $321 billion in 2010, growing at a compound annual growth rate (CAGR) of 7.7 percent between 2007 and 2010. "SEMI: Silicon wafer Shipments Flatten in Q3" http://www.edn.com/article/CA6498395.html?industryid=47037 In line with historic patterns, the pace of wafer area shipments slowed slightly in Q3, with silicon wafer area shipments totaling 2.2 billion square inches, up approximately 5 percent year-over-year from 2.1 billion square inches and essentially flat sequentially, the Silicon Manufacturers Group (SMG) of industry consortium SEMI reported late Tuesday. "'Tactile Interface' Could Aid Blind Computer Users" http://www.chipdesignmag.com/display.php?articleId=1759&issueId= A Johns Hopkins researcher has joined experts from four other institutions who plan to create a dynamic electronic surface to allow blind or visually impaired people to "feel" mathematical graphs, diagrams and other visuals now displayed on computer screens. "World's Fastest Vector Supercomputer" http://www.chipdesignmag.com/display.php?articleId=1724&issueId= NEC Corporation today announced the worldwide launch and availability of its SX series model SX-9, the world's fastest vector supercomputer with a peak processing performance of 839 TFLOPS. The SX-9 features the world.s first CPU capable of a peak vector performance of 102.4 GFLOPS per single core. "IBM BlueGene is the World's Fastest Computer Once Again" http://www.eetimes.com/news/latest/showArticle.jhtml?articleID=202805721 The BlueGene/L System, jointly developed by IBM and the U.S. Department of Energy, remains the world's fastest supercomputer, topping the latest biannual list that saw five new entrants into the top 10. The BlueGene/L System has held the No. 1 spot since November 2004. The latest list of top 500 computers was released Monday at SC07, the international conference on high-performance computing in Reno, Nev. ============================================================================== What are high-K and low-K dielectrics? --------------------------------------- Author: Jerzy Ruzyllo, Penn State University Semiconductor Notes, Note No 1, posted April 15, 2003 (http://www.semiconductornotes.com/notes/ViewFile.asp?Which=30) The dielectric constant, k, is a parameter defining ability of material to store charge. Consequently, it also defines capacitance, C, of any capacitor comprising of a layer of dielectric sandwiched between two metal plates. In the figure below size of the upper plate defines area of the capacitor contact (A). All other parameters equal, k would determine capacitance of the above structure, or in other words, it would define the extent of capacitive coupling between two conducting plates . with .high.-k dielectric such coupling would be strong, and with .low.-k dielectric being obviously weak. In Si technology the reference is a value of k of silicon dioxide, SiO2, which is 3.9. Dielectrics featuring k>3.9 are referred to as .high.-k dielectric while dielectric featuring k<3.9 are defined as .low.-k dielectrics. In cutting edge silicon nanoelectronics both high- and low-k dielectrics are needed to implement fully functional very high-density integrated circuit, although, for drastically different reasons. High-k dielectrics are needed in MOS gate stacks to maintain sufficiently high capacitance of the metal (gate)-dielectric-Si structure in MOS/CMOS transistors (Fig. 2). Due to the continued scaling of the channel length (L), and hence reduced gate area A, the need to maintain sufficient capacitance of the MOS gate stack was met by gradual decrease of the thickness of SiO2 gate oxide (see Eq.1). Obviously such scaling cannot continue indefinitely as at certain point gate oxide will become so thin (thinner than about 1 nm) that, due to excessive tunneling current, it would stop playing role of an insulator. Hence, dielectric featuring k higher than 3.9, i.e. one assuring same capacitive coupling but at the larger physical thickness of the film, must be used instead of SiO2 as a gate dielectric in advanced MOS/CMOS integrated circuits. On the opposite end of the spectrum finds itself a multi-layer metallization scheme in which inter-layerdielectric(ILD) is used to electrically insulate metal lines. In this case it is of critical importance that the capacitive coupling between adjacent interconnect lines (Fig. 3) is as limited as possible. Hence, a low-k dielectric must be used to assure as little capacitive coupling (low .cross-talk.) between interconnect lines as possible. Whether the problem is with high-k dielectrics for MOS gates or low-k dielectrics for ILDs, lack of viable technical solutions in either of these areas will bring any future progress in mainstream silicon technology to a halt. ============================================================================== Paper Submission Deadlines: ---------------------------- DAC'08 - Design Automation Conference (sponsored by SIGDA) Anaheim, CA Jun 9-13, 2008 Deadline: Nov 19, 2007 http://www.dac.com/ NOCS'08 - Int'l Symposium on Networks-on-Chips Newcastle, UK Apr 7-11, 2008 Deadline: Nov 19, 2007 http://async.org.uk/nocs2008/ TAU'08 - Int'l Workshop on Timing Issues in the Specification and Synthesis of Digital Systems (Sponsored by SIGDA) Monterey, CA Feb 25-26, 2008 Deadline: Nov 26, 2007 http://www.tauworkshop.com/ GLSVLSI'08 - Great Lakes Symposium on VLSI (Sponsored by SIGDA) Orlando, FL May 4-6, 2008 Deadline: Nov 30, 2007 http://www.glsvlsi.org/ ICAC'08 - Int'l Conference on Autonomic Computing Chicago, IL Jun 2-6, 2008 Deadline: Dec 1, 2007 http://www.acis.ufl.edu/~icac2008/ ISVLSI'08 - Annual Symposium on VLSI Montpellier, France Apr 7-9, 2008 Deadline: Dec 5, 2007 http://www.lirmm.fr/isvlsi2008/ SLIP'08 - Int'l Workshop on System Level Interconnect Prediction Newcastle, UK Apr 5-6, 2008 Deadline: Dec 7, 2007 http://www.sliponline.org/ EWME'08 - European Workshop on Microelectronics Education Budapest, Hungary May 28-30, 2008 Deadline: Dec 10, 2007 http://www.eet.bme.hu/new/index.php?option=com_content&task=view&id=129&Itemid=160 RCE'08 - Reconfigurable Computing Education Montpellier, France Apr 10, 2008 Deadline: Dec 15, 2007 http://helios.informatik.uni-kl.de/RCeducation08/ RFID'08 - Conference on RFID Las Vegas, NV Apr 16-17, 2008 Deadline: Dec 19, 2007 http://www.ieee-rfid.org/ ACSD'08 - Int'l Conference on Application of Concurrency to System Design (sponsored by SIGDA) Xi.an, China June 23-27, 2008 Deadline: Jan 4, 2008 http://ictt.xidian.edu.cn/acsd2008/Pages/ACSD_main.jsp MEMOCODE'08 - Int'l Conference on Formal Methods and Models for Codesign (sponsored by SIGDA) Anaheim, CA Jun 5-7, 2008 Deadline: Feb 1, 2008 http://svl1.cs.pdx.edu/memocode08/ ============================================================================== Upcoming Symposia, Conferences and Workshops: --------------------------------------------- PDCS'07 - Int'l Conference on Parallel and Distributed Computing Systems Cambridge, MA Nov 19-21, 2007 http://www.iasted.org/conferences/home-590.html ICST'07 - Int'l Conference on Sensing Technology Palmerston North, New Zealand Nov 26-28, 2007 http://icst.massey.ac.nz/ BIOCAS'07 - Biomedical Circuits and Systems Conference London, UK Nov 27-30, 2007 http://biocas.grm.polymtl.ca/ MICRO'07 - Int'l Symposium on Microarchitecture Chicago, IL Dec 1-5, 2007 http://www.microarch.org/micro40/ IP-SOC'07 - IP Based SoC Design Grenoble, France Dec 5-6, 2007 http://www.us.design-reuse.com/ipsoc2006/ ICPADS'07 - Int'l Conference on Parallel and Distributed Systems Hsinchu, Taiwan Dec 5-7, 2007 http://www.ccrc.nthu.edu.tw/icpads2007/ ICFPT'07 - Int'l Conference on Field-Programmable Technology Kitakyushu, Japan Dec 12-14, 2007 http://www.kameyama.ecei.tohoku.ac.jp/icfpt07/ EUC'07 - Int'l Conference on Embedded and Ubiquitous Computing Taipei, Taiwan Dec 17-20, 2007 http://www.cs.ccu.edu.tw/~shiwulo/euc07/ HiPC'07 - Int'l Conference on High Performance Computing Goa, India Dec 18-21, 2007 http://www.hipc.org/ ICM'07 - Int'l Conference on Microelectronics Cairo, Egypt Dec 29-31, 2007 http://www.ieee-icm.com/ VLSI'08 - Int'l Conference on VLSI Design (sponsored by SIGDA) ES'08 - Int'l Conference on Embedded Systems Hyderabad, India Jan 4-8, 2008 http://vlsiconference.com/vlsi2008/ ASP-DAC'08 - Asia and South Pacific Design Automation Conference (sponsored by SIGDA) Seoul, Korea Jan 21-24, 2008 http://www.aspdac.com/aspdac2008/ HiPEAC'08: Int'l Conference on High Performance Embedded Architectures & Compilers Goteborg, Sweden Jan 27-29, 2008 http://www.hipeac.net/hipeac2008/ ISSCC'08 - Int'l Solid-State Circuits Conference San Francisco, CA Feb 3-7, 2008 http://isscc.org/isscc/ LATW'08 - Latin-American Test Workshop Puebla, Mexico Feb 17-20, 2008 http://www-elec.inaoep.mx/latw2008/ FPGA'08 Int'l Symposium on Field-Programmable Gate Arrays (sponsored by SIGDA) Monterey, California February 24-26, 2008 http://www.isfpga.org DATE'08 - Design Automation and Test in Europe (sponsored by SIGDA) Munich, Germany Mar 10-14, 2008 http://www.date-conference.com/ ISQED'08 - Int'l Symposium on Quality Electronic Design San Jose, CA Mar 17-19, 2008 http://www.isqed.org/ SPL'08 - Southern Conference on Programmable Logic Bariloche-Patagonia, Argentina Mar 26-28, 2008 http://www.splconf.org/ ASYNC'08: Int'l Symposium on Asynchronous Circuits and Systems Newcastle, UK Apr 7-11, 2008 http://async.org.uk/async2008/ ISPD'08 - Int'l Symposium on Physical Design (sponsored by SIGDA) Portland, OR Apr 13-16, 2008 http://www.ispd.cc/ RAW'08 - Reconfigurable Architectures Workshop Miami, FL Apr 14-15, 2008 http://www.ece.lsu.edu/vaidy/raw/ ISCAS'08 - Int'l Symposium on Circuits and Systems Seattle, WA May 18-21, 2008 http://iscas2008.org/ ============================================================================== Upcoming Funding Opportunities ------------------------------------ James S. McDonnell Foundation Studying Complex Systems - 21st Century Science Collaborative Activity Deadline: continuous http://www.jsmf.org/programs/cs/ ETS Postdoctoral Fellowship Award Program Deadline: February 1, 2008 http://www.ets.org/portal/site/ets/menuitem.1488512ecfd5b8849a77b13bc3921509/?vgnextoid=a7d6d635e06ed010VgnVCM10000022f95190RCRD&vgnextchannel=0d03d635e06ed010VgnVCM10000022f95190RCRD DOE Broadening Participation and Collaborat Deadline: September 30, 2008 http://www.science.doe.gov/grants/FAPN08-01.html ANS Student Grant Deadline: Continuous. The committee reviews and votes on the requests at its June and November meetings. http://rrsd.ans.org/grants.html IBM IBM Herman Goldstine Fellowship Deadline: January 5, 2008 http://domino.research.ibm.com/comm/research_projects.nsf/pages/goldstine.index.html Postgraduate Opportunities Postgraduate Research Participation at the Air Force Research Laboratory, Materials Directorate, Tyndall Air Force Base Deadline: Continuous http://www.orau.gov/orise/edu/USAF/gi-pdRLMD.htm Oak Ridge National Laboratory Advanced Short-Term Research Opportunity Deadline: Continuous http://www.orau.gov/orise/edu/ornl/gi-rgpdASTRO.htm Faculty Opportunities Faculty Research Participation at the U.S. Army Research Laboratory Deadline: Continuous http://see.orau.org/ProgramDescription.aspx?Program=10084 American Association of University Women International Fellowships Deadline: December 1, 2007 http://www.aauw.org/fga/fellowships_grants/international.cfm ASEE Naval Research Laboratory (NRL) Postdoctoral Fellowship Program Deadline: Continuous. Applications are accepted on an ongoing basis. http://www.asee.org/resources/fellowships/nrl/index.cfm AAWU International Fellowships Deadline: December 1, 2007 http://www.aauw.org/fga/fellowships_grants/international.cfm NIH NLM Knowledge Management & Applied Informatics Grants Deadline: May 25, 2007 September 25, 2007 January 25, 2008 http://grants1.nih.gov/grants/guide/pa-files/PAR-07-236.html NASA Broad Agency Announcement (BAA) - N61339-06-R-0107 (Joint ADL Co-Laboratory) Deadline: Continuous http://nawctsd.navair.navy.mil/EBusiness/BusOps/Acquisitions/Index.cfm?client=STRICOM Applied Information Systems Research - NNH07ZDA001N-AISR Deadline: To be announced (TBA) http://nspires.nasaprs.com/external/solicitations/summary.do?method=init&solId=%7B89FBF877-DD5F-AC6E-DAB3-AE19504EA70D%7D&path=open DOD Modeling and Simulation for Information Systems Research Deadline: FY 09 should be submitted by June 1, 2008 FY 10 should be submitted by June 1, 2009 http://fedbizopps.cos.com/cgi-bin/getRec?id=20061030a9 TRADOC FOC-03-06: Situational Understanding Deadline: Continuous until August 26, 2009 https://abop.monmouth.army.mil/baas.nsf/1f6c118700adf19d85256d3d0051f9a2/31926e7d7d4b2e9285256f6d0056ce06?OpenDocument Military Networking Technology for Global Information Exchange (GIE) Deadline: Continuous until September, 2008 http://fedbizopps.cos.com/cgi-bin/getRec?id=20040909a11 Microsystems Technology Office-Wide BAA Deadline: January 14, 2008 http://www.fbo.gov/spg/ODA/DARPA/CMO/BAA07%2D18/SynopsisP.html ASEE-NRL Postdoctoral Fellowship Program Deadline: Continuous http://hroffice.nrl.navy.mil/jobs/postdoc.htm Cognitive Technology Threat Warning System (CT2WS) Deadline: April 11, 2008 http://fedbizopps.cos.com/cgi-bin/getRec?id=20070412a1 Warrior Systems Technologies - Body-Worn Systems, Hand Held Devices, and Smart-Lightweight Electronic Components/Modules for Soldier Protection, Knowledge Management and Cognitive Improvement Deadline: Continuous. (April 1, 2007 ~ March 31, 2009) https://www3.natick.army.mil/ssbaa.htm Homeland Security (2.2.1) - N61339-02-R-0071 Deadline: Continuous. This BAA expires on January 30, 2008 http://www1.fbo.gov/spg/DON/NAVAIR/N61339/N61339-02-R-0071/Attachments.html Microsystems Technology Office-Wide Deadline: January 14, 2009 http://www.fbo.gov/spg/ODA/DARPA/CMO/BAA07-18/Attachments.html SPINS in Semiconductors Deadline: December 31, 2008 http://fundingopps.cos.com/alerts/57993 Artificial Intelligence Technologies Deadline: December 31, 2008 http://heron.nrl.navy.mil/contracts/baa.htm Quantum Information Science and Technology Deadline: December 31, 2008 http://heron.nrl.navy.mil/contracts/0708baa/baa.htm Young Investigator Program (YIP) January 12, 2008 http://www.onr.navy.mil/sci_tech/3t/corporate/yip.asp High Density Optical Memory Deadline: Continuous http://www.afosr.af.mil/pdfs/afosr_baa_2007_1.pdf Quantum Electronic Solids Deadline: Continuous http://www.afosr.af.mil/pdfs/afosr_baa_2007_1.pdf Distributed Intelligence Deadline: Continuous http://www.afosr.af.mil/pdfs/afosr_baa_2007_1.pdf Enabling Technologies for Modeling and Simulation (BAA-03-12-IFKA) Deadline: September 30, 2008 http://www.fbo.gov/spg/USAF/AFMC/AFRLRRS/BAA-03-12-IFKA/Modification%2005.html Joint National Training Capability Broad Agency Announcement Deadline: May 14, 2009 http://www.ntsc.navy.mil/Ebusiness/BusOps/Acquisitions/Index.cfm?RND=220990 BAA for Simulation and Training Technology R&D Deadline: Continuous until December 31, 2010 http://www.ntsc.navy.mil/EBusiness/BusOps/Acquisitions/Index.cfm?RND=868451 Army Research Office (ARO) Broad Agency Announcement for Basic and Applied Scientific Research (W911NF-07-R-0003) Deadline: Continuous through September 30, 2011 http://www.arl.army.mil/www/default.cfm?Action=6&Page=8 NSF Scientific Computing Research Environments for the Mathematical Sciences (SCREMS) - NSF 07-502 Deadline: January 24, 2008 http://www.nsf.gov/pubs/2007/nsf07502/nsf07502.htm Cyber-Enabled Discovery and Innovation (CDI) Deadline: October 30, 2007 - November 30, 2007 August 30, 2008 - September 30, 2008 August 30 - September 30, Annually Thereafter High Performance Computing Acquisition: Towards a Petascale Computing Environment for Science and Engineering - NSF 05-625 Deadline: November 30, 2007 November 28, 2008 http://www.nsf.gov/pubs/2005/nsf05625/nsf05625.htm Computer Systems Research (CSR) - NSF 07-504 Deadline: January 17, 2007 http://www.nsf.gov/pubs/2007/nsf07504/nsf07504.htm Cyber Trust - NSF 07-500 Deadline: November 14, 2007 http://www.nsf.gov/pubs/2007/nsf07500/nsf07500.htm Foundations of Computing Processes and Artifacts (CPA) - NSF 07-587 Deadline: December 7, 2007 http://www.nsf.gov/pubs/2007/nsf07587/nsf07587.htm Broadening Participation Research Initiation Grants in Engineering (BRIGE) - NSF 07-589 Deadline: February 8, 2008 http://www.nsf.gov/pubs/2007/nsf07589/nsf07589.htm Expeditions in Computing Deadline: Letter of Intent Due Date(s) (required): November 05, 2007 July 10, 2008 July 10, Annually Thereafter Preliminary Proposal Due Date(s) (required): December 30, 2007 September 10, 2008 September 10, Annually Thereafter http://www.nsf.gov/pubs/2007/nsf07592/nsf07592.htm Software for Real-World Systems (SRS) - NSF 07-599 Deadline: January 17, 2008 http://www.nsf.gov/pubs/2007/nsf07599/nsf07599.htm Information and Intelligent Systems: Advancing Human-Centered Computing, Information Integration and Informatics, and Robust Intelligence - NSF 07-577 Deadline: November 19, 2007 for Large Projects December 10, 2007 for Small Projects http://www.nsf.gov/pubs/2007/nsf07577/nsf07577.htm Strategic Technologies for Cyberinfrastructure (STCI) Deadline : February 14, 2008 http://www.nsf.gov/funding/pgm_summ.jsp?pims_id=500066&org=NSF&sel_org=NSF&from=fund Engineering Design (ED) Deadline : February 15, 2008 http://www.nsf.gov/funding/pgm_summ.jsp?pims_id=13340 ============================================================================== ACM/SIGDA Outstanding New Faculty Award ----------------------------------------- ****** New Submission Deadline: December 1, 2007 ******* I am pleased to inform you that the application deadline for the annual ACM/SIGDA Outstanding New Faculty Award (ONFA) has been extended to *Dec. 1*, 2007. This is a great opportunity for new faculty members in the field of EDA (electronic design automation) or CAD (computer-aided design). For details of this award, please see attached description. Please send your application to mdfwong@uiuc.edu and cc to genzel@uiuc.edu (preferably in a single PDF file). If you have already applied but didn't get any acknowledgment from us, please re-send your application. The ACM/SIGDA Outstanding New Faculty Award recognizes a junior faculty member early in her or his academic career who demonstrates outstanding potential as an educator and/or researcher in the field of electronic design a utomation. While prior research and/or teaching accomplishments are important, the selection committee will especially consider the impact that the candidate has had on her or his department and on the EDA field during the initial years of their academic appointment. The award is presented annually at Design Automation Conference. (See http://www.sigda.org/onfa.html for details.) ============================================================================== Notice to Authors By submitting your contributions to ACM SIGDA, you acknowledge that they contain only your own work (minor edits by others are allowed) and are not subject to third-party licenses and copyrights. The contents of the ACM SIGDA newsletters are released by SIGDA into Public Domain, except when explicitly noted otherwise. SIGDA newsletters are routinely reproduced on the SIGDA Web site and the ACM Digital Library, may be reproduced in printed publications and appear on the Wikipedia Web site --- without express notice and royalties. If you wish to restrict the distribution of your work or retain copyright for your contribution, please contact the editors. Last revised by I. Markov - 05/21/06 ============================================================================== (This ACM/SIGDA E-NEWSLETTER is being sent to all persons on the ACM/SIGDA mailing list. To manage your subscription, go to "Subscriber's corner" on http://listserv.acm.org/ - you need to login using the email address where this newsletter is delivered. First time users will be required to choose a password.) ==============================================================================